| Segment |
Project |
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3D Measurement
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SISCAN, the world's fastest confocal 3D measurement systems
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Cluster Tool
|
|
|
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TIA for fully automated semiconductor manufacturing tool
|
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|
CMP
|
|
|
|
TIA for Chemical Mechanical Planarization (CMP) in the semiconductor industry
|
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|
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Cutting
|
|
|
|
SIMATIC ET 200S Compact used to control cutting systems at Meyer Burger
|
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|
Highly precise slicing machines made by Meyer+Burger AG thanks to Siemens technology
|
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|
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Deposition
|
|
|
|
CHA Industries in Silicon Valley decided to use TIA components for its equipment
|
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Etching
|
|
|
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Siltronic – SIMATIC and SINUMERIK technology in etching tool
|
|
|
|
General
|
|
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Carrier Based Monitoring Systems
|
|
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MVD Technology
|
|
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Applied MicroStructures – Siemens instrumental in advancing new MVD technology
|
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|
|
Optical Measurement
|
|
|
|
SISCAN 3D confocal sensors at EPCOS
|
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|
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Pick&Place |
|
|
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ASE relies on SIPLACE placement machines for its 0201 component production
|
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Scrubber
|
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Lang und Peitler automates exhaust scrubbers with SEMI standard F97-compliant interfaces performed by Siemens PLC solutions
|
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Standards
|
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New communication standards for the semiconductor industry
|
|
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|
Thermal Wafer Processing
|
|
|
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ASM Europe and Siemens form cooperation involving SIMATIC fail-safe controllers
|
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