The application of state-of-the-art equipment such as EMC chambers, oscilloscopes, conditioning cabinets, thermal simulations as well as thermal image cameras form the basis of our quality work.
Development tests
Already at the development stage, numerous tests are performed. For example, two test runs with 40 prototypes each are carried out. Amongst many others, the following tests are included:
- Stress test for CPU, graphics, memory, etc.
- Measuring and validation of all important signals
- Drive qualification (vibration / shock load)
- Thermal simulation
Within the scope of thermal simulation, for example, the optimum arrangement of the individual components is simulated via a CAD program. The heat flow within the PC is visualized and can then be optimized. Already at the construction stage, a device with an optimum heating concept is this created.
Production test
Products which were tested as "good" during the development, are still far from being finished. Also during production, special test procedures guarantee maximum safety. The following tests are included:
- Module test: 100% X-ray inspection of the printed circuit-board assembly (7,000 test spots)
- 100% test of the components and lines for functionality
- Automated co-ordination of customer order and device configuration
- 100% run-in test: System test of all components,
36-h heat test at 40 °C in the conditioning cabinet, corresponding to a 6-week endurance test to exclude premature failures
- 100% final inspection of all manufactured devices
- Packing and transport quality test.
Additionally, series-accompanying type tests and test runs are carried out. Efforts that are worth it. On the basis of these tests, we can guarantee that our customers receive what we have promised them: 100% functioning and high-quality products, which comply with all assured technical specifications. |
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